以下是常用的相关术语表：
板 board
母板 mother board
子板 daughter board
背板 backplane
裸板 bare board
印制电路 printed circuit
印制线路 printed wiring
印制板 printed board
印制板电路 printed circuit board
印制线路板 printed wiring board
印制元件 printed component
印制接点 printed contact
印制板装配 printed board assembly
刚性印制板 rigid printed board
挠性印制电路 flexible printed circuit
挠性印制线路 flexible printed wiring
齐平印制板 flush printed board
金属芯印制板 metal core printed board
金属基印制板 metal base printed board
多重佈线印制板 mulit-wiring printed board
模塑电路板 molded circuit board
散线印制板 discrete wiring board
微线印制板 micro wire board
积层印制板 buile-up printed board
表面层合电路板 surface laminar circuit
埋入凸块连印制板 B2it printed board
载芯片板 chip on board
埋电阻板 buried resistance board
键盘板夹心板 copper-invar-copper board
动态挠性板 dynamic flex board
静态挠性板 static flex board
可断拼板 break-away planel
电缆 cable
挠性扁平电缆 flexible flat cable (FFC)
薄膜开关 membrane switch
混合电路 hybrid circuit
厚膜 thick film
厚膜电路 thick film circuit
薄膜 thin film
薄膜混合电路 thin film hybrid circuit
互连 interconnection
导线 conductor trace line
齐平导线 flush conductor
传输线 transmission line
跨交 crossover
板边插头 edge-board contact
导电图形 conductive pattern
非导电图形 non-conductive pattern
字元legend
标誌 mark
基材base material
层压板 laminate
覆金属箔基材 metal-clad bade material
覆铜箔层压板 copper-clad laminate (CCL)
复合层压板 composite laminate
薄层压板 thin laminate
基体材料 basis material
预浸材料 prepreg
粘结片 bonding sheet
预浸粘结片 preimpregnated bonding sheer
环氧玻璃基板 epoxy glass substrate
预制内层覆箔板 mass lamination panel
基底 substrate
基板面 real estate
导线面 conductor side
元件面 component side
焊接面 solder side
印制 printing
网格 grid
图形 pattern
内层芯板 core material
粘结层 bonding layer
粘结膜 film adhesive
无支撑胶粘剂膜 unsupported adhesive film
覆盖层 cover layer (cover lay)
增强板材 stiffener material
铜箔面 copper-clad surface
去铜箔面 foil removal surface
层压板面 unclad laminate surface
基膜面 base film surface
胶粘剂面 adhesive faec
超薄型层压板 ultra thin laminate
结晶现象crystalline polamer
双晶现象dimorphism
共聚物 copolymer
环氧值 epoxy value
双氰胺 dicyandiamide
粘结剂 binder
胶粘剂 adesive
固化剂 curing agent
阻燃剂 flame retardant
遮光剂 opaquer
增塑剂 plasticizers
氟树脂 fluroresin
硅树脂 silicone resin
阶树脂 A-stage resin A
阶树脂 B-stage resin B
阶树脂 C-stage resin C
环氧树脂 epoxy resin
酚醛树脂 phenolic resin
聚酯树脂 polyester resin
聚醯亚胺树脂 polyimide resin
合成树脂 synthetic
热固性树脂 thermosetting resin
热塑性树脂 thermoplastic resin
感光性树脂 photosensitive resin
双马来醯亚胺三嗪树脂 bismaleimide-triazine resin
丙烯酸树脂 acrylic resin
三聚氰胺甲醛树脂 melamine formaldehyde resin
多官能环氧树脂 polyfunctional epoxy resin
溴化环氧树脂 brominated epoxy resin
环氧酚醛 epoxy novolac
硅烷 silane
不饱和聚酯 unsatuiated polyester
导电箔 conductive foil
铜箔 copper foil
压延铜箔rolled copper foil
退火铜箔annealed copper foil
薄铜箔 thin copper foil
涂胶铜箔adhesive coated foil
涂胶脂铜箔 resin coated copper foil
复合金属箔composite metallic material
聚酯薄膜 polyester
聚醯亚胺薄膜 polyimide film (PI)
玻璃纤维 glass fiber
玻璃纤维E-glass fibre E
玻璃纤维D-glass fibre D
玻璃纤维S-glass fibre S
玻璃布glass fabric
非织布 non-woven fabric
玻璃纤维垫 glass mats
白度 whitenness
陶瓷 ceramics
印制线路佈设 printed wire layout
佈设总图 master drawing
电脑辅助制图 computer aided drawing
装配图 assembly drawing
电脑控制显示computer controlled display
佈局 placement
佈线 routing
布图设计 layout
重布 rerouting
图形显示 graphics dispaly
比例因数 scaling factor
扫描填充 scan filling
矩形填充 rectangle filling
填充域 region filling
实体设计 physical design
逻辑设计 logic design
逻辑电路 logic circuit
元件密度 component density
导线（通道） conduction (track)
导线（体）宽度 conductor width
导线距离 conductor spacing
导线层 conductor layer
导线宽度/间距conductor line/space
第一导线层conductor layer No.1
分线separated time
分层eparated layer
孔环 annular ring
元件孔 component hole
安装孔mounting hole
支撑孔 supported hole
非支撑孔 unsupported hole
导通孔 via
镀通孔 plated through hole (PTH)
余隙孔 access hole
盲孔 blind via (hole)
埋孔 buried via hole
埋,盲孔 buried blind via
任意层内部导通孔 any layer inner via hole
全部钻孔 all drilled hole
定位孔 toaling hole
中间孔 interstitial hole
无连接盘导通孔 landless via hole
引导孔 pilot hole
端接全隙孔 terminal clearomee hole
准尺寸孔 dimensioned hole
在连接盘中导通孔 via-in-pad
孔位 hole location
孔密度 hole density
孔图 hole pattern
钻孔图 drill drawing
定顺序 definite sequence
圆形盘 round pad
方形盘 square pad
菱形盘 diamond pad
长方形焊盘 oblong pad
子弹形盘 bullet pad
泪滴盘 teardrop pad
雪人盘 snowman pad
V形盘 V-shaped pad
环形盘 annular pad
非圆形盘 non-circular pad
隔离盘 isolation pad
非功能连接盘 monfunctional pad
偏置连接盘 offset land
